• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A heat sink and fan arrangement includes a heat sink having two bottom coupling grooves disposed at two opposite lateral sides, a fan supported on the heat sink, the fan having four through holes in four corners of a bottom wall thereof, and two resilient binding wires fastened to the heat sink and the fan to secure the heat sink and the fan together, the binding wires each having a horizontal base portion respectively coupled to the bottom coupling grooves of the heat sink, two hooked tips respectively hooked in the through holes of the fan, and two vertical suspension arms connected between two distal ends of the horizontal base portion and the hooked tips.
    公开号:US20010009187A1
    申请号:US09/754,305
    申请日:2001-01-05
    公开日:2001-07-26
    发明作者:Shih-jen Lin
    申请人:Global Win Technology Co Ltd；
    IPC主号:H01L23-467
    专利说明:
    [0001] The present invention relates to a heat sink and fan arrangement and, more particularly, to such a heat sink and fan arrangement, which uses two U-shaped, hook-tip binding wires to secure the fan to the heat sink. [0001]
    [0002] Various heat sinks have been disclosed for use with a fan to dissipate heat from an electronic device, for example, a CPU (central processing unit). FIG. 6 shows a heat sink and fan arrangement for use to dissipate heat from a CPU. This arrangement comprises a heat sink adapted for attaching to the top sidewall of the CPU, a fan adapted for mounting on the heat sink at the topside, and a fan case adapted for fastening to the CPU to secure the fan, the heat sink and the CPU together. The fan case has bottom hooks adapted for hooking on the bottom sidewall of the CPU. This arrangement is functional, however the manufacturing cost of the fan case is high. Further, the fan case fits only a particular model of CPU. [0002] SUMMARY OF THE INVENTION
    [0003] The present invention has been accomplished to provide a heat sink and fan arrangement, which eliminates the aforesaid drawbacks. It is one object of the present invention to provide a heat sink and fan arrangement, which is inexpensive to manufacture. It is another object of the present invention to provide a heat sink and fan arrangement, which fits any of a variety of electronic devices. According to the present invention, two resilient binding wires are used and hooked in four through holes in four corners of the fan to secure the fan to the heat sink. [0003] BRIEF DESCRIPTION OF THE DRAWINGS
    [0004] FIG. 1 is an exploded view of a heat sink and fan arrangement according to the present invention. [0004]
    [0005] FIG. 2 is an elevational assembly view of the heat sink and fan arrangement of the present invention. [0005]
    [0006] FIG. 3 is a sectional view of the heat sink and fan arrangement showing the fastening of the binding wires according to the present invention. [0006]
    [0007] FIG. 4 is a sectional view of the heat sink and fan arrangement showing the binding wires well fastened according to the present invention. [0007]
    [0008] FIG. 5 is an elevational assembly view of an alternate form of the heat sink and fan arrangement according to the present invention. [0008]
    [0009] FIG. 6 is an exploded view of the prior art design. [0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
    [0010] Referring to FIGS. 1 and 2, a heat sink and fan arrangement in accordance with the present invention is generally comprised of a fan [0010] 1, a heat sink 2, and two resilient binding wires 3.
    [0011] The fan [0011] 1 has four through holes 11 in four corners of the bottom sidewall thereof. The heat sink 2 comprises a flat bottom contact wall 21 adapted for attaching to, for example, a CPU (central processing unit), and rows of upright radiating fins 22 raised from the top of the flat bottom contact wall 21. The two opposite lateral side rows of upright radiating fins 22 define a respective bottom coupling grooves 221. The resilient binding wires 3 each comprise a horizontal base portion 31, two hooked tips 321, and two vertical suspension arm portions 32 respectively connected between two distal ends of the horizontal base portion 31 and the hooked tips 321. The horizontal base portion 31 has a middle part 311 curved upwards.
    [0012] Referring to FIGS. 3 and 4 and FIG. 2 again, the fan [0012] 1 is attached to the radiating fins 22 of the heat sink 2 at the top side, and then the horizontal base portions 31 of the binding wires 3 are respectively attached to the coupling grooves 221 of the heat sink 2 for enabling the hooked tips 321 of the binding wires 3 to be respectively hooked in the through holes 11 of the fan 1 from the top side.
    [0013] Referring to FIGS. from [0013] 2 through 4 again, when attaching the horizontal base portions 311 of the binding wires 3 to the coupling grooves 221 of the heat sink 2, the upwardly curved middle part 311 of each binding wire 3 is deformed to lift the suspension arms 32 over the elevation of the through holes 11 of the fan 1, so that when the upward pulling force is released from the binding wires 3, the binding wires 3 immediately return to their former shape, thereby causing the hooked tips 321 of the binding wires 3 to be respectively hooked in the through holes 11 of the fan 1 to secure the fan 1 and the heat sink 2 firmly together.
    [0014] FIG. 5 shows an alternate form of the present invention. According to this alternate form, the heat sink [0014] 2 comprises two extension walls 222 vertically disposed at two opposite lateral sides and respectively stopped at two sides of the fan 1. The side extension walls 222 each have a bottom coupling groove 2221 adapted to receive the horizontal base portions 31 of the binding wires 3.
    [0015] It is to be understood that the drawings are designed for purposes of illustration only, and are not intended for use as a definition of the limits and scope of the invention disclosed. [0015]
    权利要求:
    Claims (3)
    [1" id="US-20010009187-A1-CLM-00001] 1. A heat sink and fan arrangement comprising a heat sink, a fan attached to a top side of said heat sink, and two resilient binding wires fastened to said heat sink and said fan to secure said heat sink and said fan together, wherein said fan comprises four through holes in four corners of a bottom wall thereof; said heat sink comprises two bottom coupling grooves disposed at two opposite lateral sides; said resilient binding wires each comprise a horizontal base portion respectively coupled to the bottom coupling grooves of said heat sink, two hooked tips respectively hooked in the through holes of said fan, and two vertical suspension arms connected between two distal ends of said horizontal base portion and said hooked tips.
    [2" id="US-20010009187-A1-CLM-00002] 2. The heat sink and fan arrangement of
    claim 1 , wherein said heat sink comprises two extension walls vertically disposed at two opposite lateral sides, and said bottom coupling grooves are respectively formed on said extension walls at a bottom side.
    [3" id="US-20010009187-A1-CLM-00003] 3. The heat sink and fan arrangement of
    claim 2 , wherein said extension walls of said heat sink are respectively stopped at two opposite lateral sides of said fan.
    类似技术:
    公开号 | 公开日 | 专利标题
    US6518507B1|2003-02-11|Readily attachable heat sink assembly
    US7055589B2|2006-06-06|Clip for heat sink
    US6119765A|2000-09-19|Structure of heat dissipating pieces of memories
    US6308773B2|2001-10-30|Heat sink and fan arrangement
    US6392885B1|2002-05-21|Fan holder
    US6520250B2|2003-02-18|Fan holder
    US7218525B2|2007-05-15|Fastener for heat sink
    US6848929B2|2005-02-01|Land grid array socket with reinforcing plate
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    US20040125566A1|2004-07-01|Heat sink assembly with fixing mechanism
    US6145586A|2000-11-14|Heat sink module with heat dissipating device
    US6341644B1|2002-01-29|Heat sink assembly
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    US6343013B1|2002-01-29|Heat sink assembly
    US20040001318A1|2004-01-01|Retaining assembly for heat sink
    US7385822B1|2008-06-10|Clip assembly
    US6729385B1|2004-05-04|Fin structure and the assembly thereof
    US6775138B2|2004-08-10|Heat sink clip with plurality of pressing portions
    US20050088819A1|2005-04-28|Heat dissipating device with fan holder
    US5828550A|1998-10-27|Heat dissipating fan/integrated circuit assemblies
    US6501656B1|2002-12-31|Clip for heat sink
    US6343015B1|2002-01-29|Heat sink clip
    US6466445B1|2002-10-15|Clip for heat sink
    同族专利:
    公开号 | 公开日
    US6308773B2|2001-10-30|
    TW458384U|2001-10-01|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    US20020179285A1|2001-05-30|2002-12-05|Sas Adrian Pieter|Folded-fin heat sink assembly and method of manufacturing same|
    US20050092463A1|2003-10-29|2005-05-05|Edward Lopatinsky|Multi-heatsink integrated cooler|
    US20050183843A1|2004-02-13|2005-08-25|Fujikura Ltd.|Heat sink|
    US20090123362A1|2005-07-16|2009-05-14|Norbert Roesch|Process for producing nanocrystalline alpha-AI2O3|
    US20100236764A1|2009-03-19|2010-09-23|Fu Zhun Precision IndustryCo., Ltd.|Heat dissipation device|
    US20100258282A1|2009-04-10|2010-10-14|Fu Zhun Precision IndustryCo., Ltd.|Heat dissipation device having fan holders|US5509465A|1995-03-10|1996-04-23|Bioli Corporation|Heat-dissipating device for a central processing unit chip|
    US5678627A|1996-01-03|1997-10-21|Lee; Richard|CPU heat sink mounting structure|TW509348U|2001-06-18|2002-11-01|Global Win Technology Co Ltd|Heat dissipation apparatus|
    TW584275U|2003-06-25|2004-04-11|Hon Hai Prec Ind Co Ltd|Heat sink assembly|
    US20060032616A1|2004-08-11|2006-02-16|Giga-Byte Technology Co., Ltd.|Compound heat-dissipating device|
    US7639497B2|2007-12-10|2009-12-29|Hong Fu Jin Precision IndustryCo., Ltd.|Heat dissipation device having a fan mounted thereon|
    CN101772293B|2009-01-07|2013-06-05|富准精密工业有限公司|Radiating device|
    法律状态:
    2001-01-05| AS| Assignment|Owner name: GLOBAL WIN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:LIN, SHIH-JEN;REEL/FRAME:011424/0348 Effective date: 20001130 |
    2005-10-31| LAPS| Lapse for failure to pay maintenance fees|
    2005-11-30| STCH| Information on status: patent discontinuation|Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
    2005-12-27| FP| Expired due to failure to pay maintenance fee|Effective date: 20051030 |
    优先权:
    申请号 | 申请日 | 专利标题
    TW89201265U|TW458384U|2000-01-25|2000-01-25|Fixing device of heat sink|
    TW089201265||2000-01-25||
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